Effects of germanium on oxygen precipitation in heavily boron - doped czochralski silicon 鍺對重?fù)脚鹬崩柚醒醭恋淼挠绊?i class="labawb" onClick="playMp3('sound_c_1')">
Oxygen precipitation characterization of silicon wafers by measurement of interstitial oxygen reduction 硅片氧沉淀特性的測定-間隙氧含量減少法
Test methods for oxygen precipitation characterization of silicon wafers by measurement of interstitial oxygen reduction 通過測量間隙氧含量的減少表征硅片氧沉淀特性的方法
Finally , the effect of rapid thermal process ( rtp ) on oxygen precipitation in hb is investigated in this paper 最后文章還系統(tǒng)研究了快速熱處理( rtp )對重?fù)脚鸸鑶尉е醒醭恋淼挠绊憽?
Fumio shimura , et al . carbon enhancement effect on oxygen precipitation in czochralski silicon [ j ] . j appl phys , 1986 , 59 : 3251 劉培東,朱愛平,張錦心等.碳和氮原子在氧沉淀中的作用[ j ] .半導(dǎo)體學(xué)報, 1999 , 20 : 107
The experimental results showed that high density of oxygen precipitation and induced - defects were formed after annealing of wafers at moderate and high temperatures 重?fù)缴楣鑶尉г谥懈邷赝嘶饡r形成密度較高的氧沉淀及誘生缺陷。
The nucleation temperature of oxygen precipitation is about 750 c in lightly doped czsi , while the nucleation in heavily as - doped si occurred at a higher temperature ( 750 - 900 c ) 普通直拉硅氧沉淀在低溫750形核,重?fù)絘s硅單晶形核溫度較高,在750 - 900之間。
Both the size and density of oxygen precipitation increase with the annealing time , and the size of oxygen precipitation decrease with the increase of the annealing temperature 隨著退火時間的延長氧沉淀尺寸增大,密度略有增加;隨著退火溫度的升高,氧沉淀尺寸相對減小。
A modified ig process was suggested , through which a wider denuded - zone ( dz ) on the surface of wafers and higher density of oxygen precipitation in silicon bulk were obtained 使用改進(jìn)的內(nèi)吸除工藝,在重?fù)缴楣杵砻嫘纬闪溯^寬的清潔區(qū),體內(nèi)形成了較高密度的氧沉淀和誘生缺陷。
Tem showed that the faults and dislocation loops introduced by the oxygen precipitation were formed when the wafers were annealed at moderate temperature , and polyhedral oxygen precipitation was generated at high temperature 對氧沉淀形態(tài)及誘生缺陷進(jìn)行了tem測試分析,結(jié)果表明,在中溫退火時出現(xiàn)氧沉淀引起的層錯和位錯環(huán);在高溫退火后生成了多面體形狀的氧沉淀。